Concepedia

Wei He

WH

5

Publications

304

Citations

5

H-Index

2020

Active since

Affiliations

Nanjing University of Science and Technology(Current)

Wei He is an author at Nanjing University of Science and Technology specializing in microfabrication, electronic packaging, and engineering.

Top concepts

EngineeringMicroelectronicsMicrofabricationElectronic PackagingHeat TransferMicrofluidicsThermal EngineeringComputer Engineering3D PrintingRefrigeration

Publications per year

2020–2024

5

Publications

5

A comparative study among machine learning and numerical models for simulating groundwater dynamics in the Heihe River Basin, northwestern China

Chong Chen, Wei He, Han Zhou et al. · Scientific Reports · 2020 · 200 citations · Full text

Investigation of heat transfer performance for through-silicon via embedded in micro pin fins in 3D integrated chips

Wei He, Zixuan Wang, Jiaqi Li et al. · International Journal of Heat and Mass Transfer · 2023 · 33 citations

3D Ic Architecture, Chip-scale Package, Engineering +13

Multi-field coupling in designing embedded microchannels for three-dimensional integrated chip: A topology optimization approach

Wei He, Jianhong Zhou, Xuemei Chen et al. · Applied Thermal Engineering · 2024 · 26 citations

3D Ic Architecture, Electrical Engineering, Multi-field Coupling +14

Integrated manifold microchannels and near-junction cooling for enhanced thermal management in 3D heterogeneous packaging technology

Wei He, Ershuai Yin, Zhou Fan et al. · Energy · 2024 · 24 citations

3D Ic Architecture, Engineering, Advanced Packaging (Semiconductors) +15

Multiobjective Optimization for Heat Transfer Performance of Micro-Fins and Signal Integrity of Key Interconnect Technologies in 3-D Integrated Chips

Wei He, Ershuai Yin, Qiang Li · IEEE Transactions on Components Packaging and Manufacturing Technology · 2022 · 21 citations

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