Concepedia

Shu Ma

SM

Statistics

Publications

1

Citations

68

H-Index

1

Active since

2016

Affiliations

University Town of Shenzhen(Current)

Shu Ma is an author at University Town of Shenzhen specializing in die-to-wafer bonding, semiconductor devices, and metallic materials.

Publications per year

2016–2016

1

Publications

1

Ni 3 Sn 4 -composed die bonded interface rapidly formed by ultrasonic-assisted soldering of Sn/Ni solder paste for high-temperature power device packaging

Hongjun Ji, Minggang Li, Shu Ma et al. · Materials & Design · 2016 · 68 citations

Engineering, Materials Engineering, Materials Science +17

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