Concepedia

Ji Wu

JW

Statistics

Publications

7

Citations

161

H-Index

7

Active since

2005

Affiliations

University of Maryland, College Park(Current)

Ji Wu is an author at University of Maryland, College Park specializing in engineering, electronic packaging, and electrical engineering.

Top concepts

EngineeringElectronic PackagingElectrical EngineeringMaterial ScienceMicroelectronicsFlexible ElectronicsElectrical InsulationCorrosionChemical EngineeringMaterials Engineering

Publications per year

2005–2008

7

Publications

7

Are you ready for lead-free electronics?

Valérie Eveloy, Subramaniam Ganesan, Y. Fukuda et al. · IEEE Transactions on Components and Packaging Technologies · 2005 · 46 citations

Lead Conversion, Lead-free Electronics, Engineering +20

Effects of Printed Circuit Board Materials on Lead-free Interconnect Durability

Haiyu Qi, Subramaniam Ganesan, Ji Wu et al. · 2006 · 28 citations

Thermomechanical Properties, Engineering, Lead Free Assemblies +21

Contact resistance and fretting corrosion of lead-free alloy coated electrical contacts

Ji Wu, Michael Pecht · IEEE Transactions on Components and Packaging Technologies · 2006 · 20 citations

Materials Engineering, Materials Science, Electrical Engineering +15

Contact Resistance Estimation for Time-Dependent Silicone Elastomer Matrix of Land Grid Array Socket

Shuang Yang, Ji Wu, D. Tsai et al. · IEEE Transactions on Components and Packaging Technologies · 2007 · 19 citations

Engineering, Mechanical Engineering, Contact Resistance Simulation +17

Electrochemical migration of land grid array sockets under highly accelerated stress conditions

Shuang Yang, Ji Wu, Michael Pecht · 2005 · 19 citations

Engineering, Electrode-electrolyte Interface, Silver Particles +18

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