Concepedia

Hsiu-Jen Lin

HL

6

Publications

110

Citations

6

H-Index

2006

Active since

Affiliations

National Taiwan University(Current)

Industrial Technology Research Institute

Hsiu-Jen Lin is an author at National Taiwan University specializing in materials science, engineering, and applied physics.

Top concepts

Publications per year

2006–2010

6

Publications

6

Inhibition of Whisker Growth on the Surface of Sn-3Ag-0.5Cu-0.5Ce Solder Alloyed with Zn

Tung‐Han Chuang, Hsiu-Jen Lin · Journal of Electronic Materials · 2008 · 27 citations

, , +10

Effects of Ce and Zn additions on the microstructure and mechanical properties of Sn–3Ag–0.5Cu solder joints

Hsiu-Jen Lin, Tung‐Han Chuang · Journal of Alloys and Compounds · 2010 · 23 citations

, , +7

Electromigration of Sn–3Ag–0.5Cu and Sn–3Ag–0.5Cu–0.5Ce–0.2Zn solder joints with Au/Ni(P)/Cu and Ag/Cu pads

Hsiu-Jen Lin, Jian‐Shian Lin, Tung‐Han Chuang · Journal of Alloys and Compounds · 2009 · 22 citations

, , +8

Intermetallic compounds formed during diffusion soldering of Au/Cu/Al2O3 and Cu/Ti/Si with Sn/In interlayer

Tung‐Han Chuang, Hsiu-Jen Lin, Cheng-Wen Tsao · Journal of Electronic Materials · 2006 · 15 citations

, , +9

Intermetallic reactions in reflowed and aged Sn-9Zn solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads

Hsiu-Jen Lin, Tung‐Han Chuang · Journal of Electronic Materials · 2006 · 13 citations

, , +8

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