Intermetallic compounds formed during diffusion soldering of Au/Cu/Al2O3 and Cu/Ti/Si with Sn/In interlayer

Rapid formation of intermetallic compounds interdiffusion in the CuSn and NiSn systems

S. Bäder, W. Gust, H. Hieber · Acta Metallurgica et Materialia · 1995 · 221 citations

A study of solute diffusion in liquid tin

Carrillo Ma, R.A. Swalin · Acta Metallurgica · 1960 · 133 citations

Materials Science, Solute Diffusion, Diffusion Resistance +2

Characterization of the reaction process in diffusion-soldered Cu/In–48 at.% Sn/Cu joints

S. Sommadossi, W. Gust, E. J. Mittemeijer · Materials Chemistry and Physics · 2002 · 53 citations

Materials Science, Materials Engineering, Engineering +5

Advances in Bonding Technology for Electronic Packaging

Chin C. Lee, Chen Y. Wang, G. Matijasevic · Journal of Electronic Packaging · 1993 · 53 citations

Liquid Phase Diffusion, Engineering, Mechanical Engineering +19

Phase identification and growth kinetics of the intermetallic compounds formed during in-49Sn/Cu soldering reactions

Tung‐Han Chuang, Cheng-Lun Yu, S. Y. Chang et al. · Journal of Electronic Materials · 2002 · 50 citations

Materials Science, Materials Engineering, Phase Identification +12