Concepedia

Haibo Fan

HF

Statistics

Publications

6

Citations

104

H-Index

6

Active since

2006

Affiliations

Hong Kong University of Science and Technology(Current)

University of Hong Kong

Haibo Fan is an author at Hong Kong University of Science and Technology specializing in engineering, electronic packaging, and materials science.

Top concepts

EngineeringSurface ScienceMaterial ScienceElectronic PackagingHeat TransferApplied PhysicsThermal EngineeringMechanical EngineeringPhysicsChemistry

Publications per year

2006–2020

6

Publications

6

Flow dependence of interfacial thermal resistance in nanochannels

Chong Liu, Haibo Fan, Kai Zhang et al. · The Journal of Chemical Physics · 2010 · 31 citations · Full text

Engineering, Fluid Mechanics, Mechanical Engineering +17

Interfacial Adhesion Study for SAM Induced Covalent Bonded Copper-EMC Interface by Molecular Dynamics Simulation

Chi‐Kong Wong, Haibo Fan, M.M.F. Yuen · IEEE Transactions on Components and Packaging Technologies · 2008 · 27 citations

Engineering, Molecular Self-assembly, Chemistry +19

Optimization of Epoxy Molding Compound to Enhance the Solder Joints Robustness during Thermal Cycling for A Clip Bond Power Package

Zhiwen Li, Haibin Chen, Haibo Fan et al. · 2020 · 13 citations

Prediction of Material Properties of Epoxy Materials using Molecular Dynamic Simulation

Haibo Fan, Chi‐Kong Wong, M.M.F. Yuen · 2006 · 12 citations

Thermal performance of LED packages for solid state lighting with novel cooling solutions

Kai Zhang, David G. W. Xiao, Xiaohua Zhang et al. · 2011 · 11 citations

Piezoelectric Fans, Engineering, Liquid Metal Cooling +17

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