Sergej Deutsch

TSV defects and TSV-induced circuit failures: The third dimension in test and design-for-test

Krishnendu Chakrabarty, Sergej Deutsch, Himanshu Thapliyal et al. · 2012 · 68 citations

Engineering, Integrated Circuits, Tsv-induced Circuit Failures +21

Contactless Pre-Bond TSV Test and Diagnosis Using Ring Oscillators and Multiple Voltage Levels

Sergej Deutsch, Krishnendu Chakrabarty · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · 2014 · 57 citations

Electrical Engineering, Physical Design (Electronics), Engineering +14

DfT architecture and ATPG for Interconnect tests of JEDEC Wide-I/O memory-on-logic die stacks

Sergej Deutsch, Brion Keller, Vivek Chickermane et al. · 2012 · 38 citations

Engineering, Vlsi Design, Mem Testing +18

Non-invasive pre-bond TSV test using ring oscillators and multiple voltage levels

Sergej Deutsch, Krishnendu Chakrabarty · Design, Automation, and Test in Europe · 2013 · 29 citations

Hardware Security, 3D Ic Architecture, Electrical Engineering +13

Non-Invasive Pre-Bond TSV Test Using Ring Oscillators and Multiple Voltage Levels

Sergej Deutsch, Krishnendu Chakrabarty · Design, Automation & Test in Europe Conference & Exhibition (DATE), 2013 · 2013 · 27 citations

Hardware Security, 3D Ic Architecture, Electrical Engineering +13