Statistics
Publications
2
Citations
26
H-Index
2
Active since
2015
Affiliations
Indium Corporation (United States)(Current)
Andy Mackie is an author at Indium Corporation (United States) specializing in aqueous cleaning, flip-chip packaging, and semiconductor devices.
Publications per year
2015–2022
2
2
Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous Integrated Packages
D.W. Lee, Ryan W. Mayberry, Andy Mackie et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 14 citations
Engineering, High-performance Computing, Materials Engineering +17
Flux challenges in flip-chip die-attach
Sze-Pei Lim, Jason Chou, Maria Durham et al. · 2015 · 12 citations
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