Statistics
Publications
2
Citations
46
H-Index
2
Active since
2012
Affiliations
Ulvac (Japan)(Current)
Toshiyuki Sakuishi is an author at Ulvac (Japan) specializing in interposer technology, through-silicon vias, and integrated circuit design.
Publications per year
2012–2014
2
2
Novel TSV process technologies for 2.5D/3D packaging
Yasuhiro Morikawa, T. Murayama, Toshiyuki Sakuishi et al. · 2014 · 23 citations
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