T. Schaffer

The delay vernier pattern generation technique

G. Moyer, M. Clements, Wai-keung Lui et al. · IEEE Journal of Solid-State Circuits · 1997 · 17 citations

Engineering, Vlsi Design, Optic Design +17

A flip-chip implementation of the Data Encryption Standard (DES)

T. Schaffer, A. Glaser, Siddharth Rao et al. · 2002 · 14 citations

Engineering, Vlsi Design, Information Security +16

Chip-Package Co-Implementation of a Triple DES Processor

T. Schaffer, A. Glaser, Paul D. Franzon · IEEE Transactions on Advanced Packaging · 2004 · 14 citations

Hardware Security, System On Chip, Electrical Engineering +15

Issues in partitioning integrated circuits for MCM-D/flip-chip technology

Sanjeev Banerjia, A. Glaser, C. Harvatis et al. · 2002 · 12 citations

Engineering, Vlsi Design, Mcm-d/flip-chip-solder-bump Technology +18