Velsankar Ramachandran

Statistics

Publications

Citations

H-Index

Active since

2017

Affiliations

Velsankar Ramachandran is an author at National Tsing Hua University specializing in materials engineering, creep behavior, and stress-strain behavior.

Publications per year

2017–2018

Publications

Overview Study of Solder Joint Reliablity due to Creep Deformation

Velsankar Ramachandran, Kuo‐Wei Wu, Kuo‐Ning Chiang · Journal of Mechanics · 2018 · 24 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +17

Feasibility Evaluation of Creep Model for Failure Assessment of Solder Joint Reliability of Wafer-Level Packaging

Velsankar Ramachandran, Kuo‐Ning Chiang · IEEE Transactions on Device and Materials Reliability · 2017 · 12 citations

Engineering, Materials Engineering, Materials Science +17

1–2 of 2