Alicja Palczynska

Thermal deformation analysis of automotive electronic control units subjected to passive and active thermal conditions

Bulong Wu, Bongtae Han, Alicja Palczynska et al. · 2015 · 16 citations

Engineering, Outer Emc, Mechanical Engineering +17

Towards prognostics and health monitoring: The potential of fault detection by piezoresistive silicon stress sensor

Alicja Palczynska, Alexandra Prisacaru, Przemyslaw Jakub Gromala et al. · 2016 · 14 citations

Towards Prognostics, Fault Diagnosis, Condition Monitoring +15

Accuracy of CMOS-Based Piezoresistive Stress Sensor for Engineering Applications of Thermal Loading Condition: Theoretical Review and Experimental Validation

Alexandru Prisacaru, Alicja Palczynska, Przemyslaw Jakub Gromala et al. · IEEE Sensors Journal · 2019 · 14 citations

Engineering, Experimental Validation, Measurement +21

<inline-formula> <tex-math notation="LaTeX">$In\ Situ$ </tex-math> </inline-formula> Failure Detection of Electronic Control Units Using Piezoresistive Stress Sensor

Alexandru Prisacaru, Alicja Palczynska, Andreas Theissler et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 12 citations

Fault Diagnosis, Silicon Stress Sensor, Automotive Industry +20

Prognostic approaches for the wirebond failure prediction in power semiconductors: A case study using DPAK package

Przemyslaw Jakub Gromala, Alicja Palczynska, Bongtae Han · 2015 · 11 citations

Standard Dpak Component, Engineering, Mechanical Engineering +20