Concepedia

Jin Young Khim

JY

Statistics

Publications

3

Citations

113

H-Index

3

Active since

2005

Affiliations

Amkor Technology (United States)(Current)

Jin Young Khim is an author at Amkor Technology (United States) specializing in packaging engineering, chip packaging, and engineering.

Publications per year

2005–2007

3

Publications

3

A Methodology for Drop Performance Modeling and Application for Design Optimization of Chip-Scale Packages

Seung Mo Kim, Wei Lin, Jin Young Khim et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2007 · 66 citations

, , +16

A methodology for drop performance prediction and application for design optimization of chip scale packages

A. Syed, Seung Mo Kim, Wei Lin et al. · 2005 · 30 citations

, , +17

Rheological Characterization and Full 3D Mold Flow Simulation in Multi-Die Stack CSP of Chip Array Packaging

Min Woo Lee, Jin Young Khim, Min Yoo et al. · 2006 · 17 citations

, , +12

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