Hobie Yun

Ultrathin High-Q 2-D and 3-D RF Inductors in Glass Packages

Min Suk Kim, Venky Sundaram, Rao Tummala et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 27 citations

Engineering, Electrical Engineering, Materials Science +17

Electroless and Electrolytic Copper Plating of Glass Interposer Combined with Metal Oxide Adhesion Layer for Manufacturing 3D RF Devices

Zhiming Liu, Hailuo Fu, Sara Hunegnaw et al. · 2016 · 21 citations

Natural Sciences, Materials Engineering, Materials Science +15

TGV (Thru-Glass Via) Metallization by Direct Cu Plating on Glass

Shigeo Onitake, Kotoku Inoue, Masatoshi Takayama et al. · 2016 · 18 citations

Natural Sciences, Materials Engineering, Materials Science +14

Development of the integrated passive device using through-glass-via substrate

Jun Onohara, Fusao Takagi, Takashi Kizu et al. · 2018 · 14 citations

Engineering, Computer Engineering, Electrical Engineering +17

20" x 20" Panel Size Glass IPD Interposer Manufacturing

Yuhua Chen, Chun-Hsien Chien, Yu-Chung Hsieh et al. · 2016 · 13 citations

Engineering, Electrical Engineering, Materials Science +13