Meng‐Kuang Huang

Improvement of wettability and tensile property in Sn–Ag–RE lead-free solder alloy

L Wang, Ding Yu, Jianguo Zhao et al. · Materials Letters · 2002 · 79 citations

Materials Engineering, Materials Science, Engineering +4

Developing a lead-free solder alloy Sn-Bi-Ag-Cu by mechanical alloying

Chi‐Man Lawrence Wu, Meng‐Kuang Huang, J.K.L. Lai et al. · Journal of Electronic Materials · 2000 · 50 citations

Materials Science, Materials Engineering, Engineering +6

Microstructural evolution of a lead-free solder alloy Sn-Bi-Ag-Cu prepared by mechanical alloying during thermal shock and aging

Meng‐Kuang Huang, Chi‐Man Lawrence Wu, J.K.L. Lai et al. · Journal of Electronic Materials · 2000 · 39 citations

Materials Science, Materials Engineering, Engineering +8

Interfacial reactions in the Sn–xBi/Au couples

Yee‐Wen Yen, Wei-Kai Liou, Chao-Ming Chen et al. · Materials Chemistry and Physics · 2011 · 12 citations

Genetics, Intimate Relationship, Interfacial Reactions

Effects of different printed-circuit-board surface finishes on the formation and growth of intermetallics at thermomechanically fatigued, small outline J leads/Sn-Ag-Cu interfaces

Pei‐Lin Wu, Meng‐Kuang Huang, Chiapyng Lee et al. · Journal of Electronic Materials · 2004 · 11 citations

Materials Science, Engineering, Surface Science +6