Khyoupin Khoo

Effect of the Purity of Plating Materials on the Reduction of Resistivity of Cu wires for Future LSIs

Jin Onuki, Suguru Tashiro, Khyoupin Khoo et al. · Journal of The Electrochemical Society · 2010 · 27 citations

Materials Engineering, Materials Science, Electrical Engineering +13

Grain coarsening mechanism of Cu thin films by rapid annealing

Yasushi Sasajima, Junpei Kageyama, Khyoupin Khoo et al. · Thin Solid Films · 2010 · 22 citations

Materials Science, Materials Engineering, Engineering +9

Observation of Microstructures in the Longitudinal Direction of Very Narrow Cu Interconnects

Khyoupin Khoo, Jin Onuki, Takahiro Nagano et al. · Japanese Journal of Applied Physics · 2006 · 19 citations

Materials Science, Electrical Engineering, Electromigration Technique +14

Influence on the Electro-Migration Resistance by Line Width and Average Grain Size along the Longitudinal Direction of Very Narrow Cu Wires

Khyoupin Khoo, Suguru Tashiro, Jin Onuki · MATERIALS TRANSACTIONS · 2010 · 14 citations · Full text

Materials Science, Materials Engineering, Electrical Engineering +14

Texture investigation in the trench depth direction of very fine copper wires less than 100nm wide using electron backscatter diffraction

Khyoupin Khoo, Jin Onuki · Thin Solid Films · 2009 · 14 citations

Electrical Engineering, Engineering, Physics +5