W.S. Lee

Publications

Citations

H-Index

2006

Active since

Affiliations

Korea Advanced Institute of Science and Technology(Current)

W.S. Lee is an author at Korea Advanced Institute of Science and Technology specializing in electronic packaging, heat transfer, and microfabrication.

Top concepts

EngineeringHeat TransferThermodynamicsApplied PhysicsMaterial ScienceMicroelectronicsMicrofabricationThermal EngineeringElectronic PackagingElectrical Engineering

Publications per year

2006–2006

Publications

Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique

W.S. Lee, Inhak Han, Jin Yu et al. · Thermochimica Acta · 2006 · 61 citations

Materials Science, Electrical Engineering, Conductive Underfill +15

Rows per page

1–1 of 1