Inhak Han

Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique

W.S. Lee, Inhak Han, Jin Yu et al. · Thermochimica Acta · 2006 · 61 citations

Materials Science, Electrical Engineering, Conductive Underfill +15

Pulser gating: A clock gating of pulsed-latch circuits

Sang Min Kim, Inhak Han, Seungwhun Paik et al. · 2011 · 21 citations

Engineering, Vlsi Design, Pulser Gating +17

Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique

Wang‐Sang Lee, Inhak Han, Jin Yu et al. · 2005 · 20 citations

Engineering, Flip Chip Package, Thermal Conductivity +19

Thermal signature

Jaeha Kung, Inhak Han, Sachin S. Sapatnekar et al. · 2011 · 19 citations

Floorplan Optimization, Electrical Engineering, Physical Design (Electronics) +13

Pulser gating: a clock gating of pulsed-latch circuits

Sang Min Kim, Inhak Han, Seungwhun Paik et al. · Asia and South Pacific Design Automation Conference · 2011 · 18 citations

Engineering, Vlsi Design, Pulser Gating +17