J. A. Kelber

Cu interactions with α-Al2O3(0001): effects of surface hydroxyl groups versus dehydroxylation by Ar-ion sputtering

Chunping Niu, K Shepherd, D. Martini et al. · Surface Science · 2000 · 100 citations · Full text

Materials Science, Materials Engineering, Surface Characterization +8

Copper wetting of α-Al2O3(0001): theory and experiment

J. A. Kelber, Chengyu Niu, K Shepherd et al. · Surface Science · 2000 · 94 citations

Materials Science, Materials Engineering, Copper Wetting +5

Effect of surface impurities on the Cu/Ta interface

L Chen, N.P. Magtoto, B. Ekstrom et al. · Thin Solid Films · 2000 · 58 citations

Materials Science, Electromigration Technique, Surface Impurities +3

Dielectric breakdown of ultrathin aluminum oxide films induced by scanning tunneling microscopy

N.P. Magtoto, Chunping Niu, B. Ekstrom et al. · Applied Physics Letters · 2000 · 33 citations

Engineering, Ultrathin Aluminum, Vacuum Device +16

Electrodeposition of copper on Ru(0001) in sulfuric acid solution: Growth kinetics and nucleation behavior

J. A. Kelber, S. Rudenja, Cameron Bjelkevig · Electrochimica Acta · 2005 · 29 citations

Materials Science, Engineering, Nucleation Behavior +7