Ding-Ming Kwai

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Publications

Citations

1.1K

H-Index

Active since

1998

Affiliations

Industrial Technology Research Institute(Current)

National Tsing Hua University

University of California, Santa Barbara

ITRI International

National Taiwan University

Ding-Ming Kwai is an author at Industrial Technology Research Institute specializing in computer engineering, engineering, and electrical engineering.

ORCID

Publications per year

1998–2018

Publications

On-Chip TSV Testing for 3D IC before Bonding Using Sense Amplification

Po‐Yuan Chen, Cheng‐Wen Wu, Ding-Ming Kwai · 2009 · 146 citations

Engineering, Computer Engineering, Electrical Engineering +14

On-chip testing of blind and open-sleeve TSVs for 3D IC before bonding

Po‐Yuan Chen, Cheng‐Wen Wu, Ding-Ming Kwai · 2010 · 128 citations

Engineering, Computer Engineering, Electrical Engineering +17

A unified formulation of honeycomb and diamond networks

Behrooz Parhami, Ding-Ming Kwai · IEEE Transactions on Parallel and Distributed Systems · 2001 · 74 citations

Computing, Computer Science, Computer Networks +16

A built-in self-test scheme for the post-bond test of TSVs in 3D ICs

Yu-Jen Huang, Jin-Fu Li, Ji-Jan Chen et al. · 2011 · 72 citations

Engineering, Computer Engineering, Electrical Engineering +16

Performance Characterization of TSV in 3D IC via Sensitivity Analysis

Jhih-Wei You, Shi‐Yu Huang, Ding-Ming Kwai et al. · 2010 · 65 citations

Engineering, Computer Engineering, Electrical Engineering +17

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