Concepedia

S. Oizumi

SO

Statistics

Publications

2

Citations

22

H-Index

2

Active since

2002

Affiliations

Nitto (United States)(Current)

S. Oizumi is an author at Nitto (United States) specializing in electronic packaging, materials science, and advanced packaging.

Top concepts

EngineeringMaterial ScienceMicrofabricationAdvanced PackagingElectronic PackagingMechanics Of Materials3D PrintingFood PackagingApplied PhysicsSolid Mechanics

Publications per year

2002–2003

2

Publications

2

Molding compounds for thin surface mount packages and large chip semiconductor devices

S. Ito, T. Nishioka, S. Oizumi et al. · 2002 · 12 citations

Materials Science, Advanced Packaging, Chip-scale Package +15

Special properties of molding compounds for large surface-mounting devices

S. Ito, S. Oizumi, José Adachi et al. · 2003 · 10 citations

Food Packaging, Engineering, Mechanical Engineering +16

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