Statistics
Publications
24
Citations
1.1K
H-Index
15
Active since
1964
Affiliations
R.J. Wenzel is an author at Bendix Field Engineering Corporation (United States) specializing in electrical engineering, engineering, and electromagnetic compatibility.
Publications per year
1964–2010
24
24
The Redistributed Chip Package: A Breakthrough for Advanced Packaging
Beth Keser, Craig Amrine, Trung Q. Duong et al. · 2007 · 112 citations
Advanced Packaging, Industrial Design, Electrical Engineering +14
1–5 of 24