Craig E. Green

Integrated Circuit Cooling Using Heterogeneous Micropin-Fin Arrays for Nonuniform Power Maps

Thomas E. Sarvey, Yuanchen Hu, Craig E. Green et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2017 · 44 citations

Electrical Engineering, High Density Cluster, Engineering +13

Flow boiling of R245fa in a microgap with staggered circular cylindrical pin fins

Pouya Asrar, Xuchen Zhang, Craig E. Green et al. · International Journal of Heat and Mass Transfer · 2018 · 38 citations

Flow Boiling, Heat Transfer Process, Engineering +10

Flow regimes and convective heat transfer of refrigerant flow boiling in ultra-small clearance microgaps

Mohamed H. Nasr, Craig E. Green, Peter A. Kottke et al. · International Journal of Heat and Mass Transfer · 2017 · 32 citations · Full text

Refrigerant Flow, Heat Transfer Process, Engineering +9

Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications

Xuchen Zhang, Xuefei Han, Thomas E. Sarvey et al. · Journal of Electronic Packaging · 2016 · 26 citations

Micropin-fin Arrays, Engineering, Liquid Metal Cooling +23

Hotspot Thermal Management With Flow Boiling of Refrigerant in Ultrasmall Microgaps

Mohamed H. Nasr, Craig E. Green, Peter A. Kottke et al. · Journal of Electronic Packaging · 2016 · 24 citations

Engineering, Liquid Metal Cooling, Energy Efficiency +16