Yingqiong Yong

Low temperature sintering process of copper fine particles under nitrogen gas flow with Cu²⁺-alkanolamine metallacycle compounds for electrically conductive layer formation

Tetsu Yonezawa, Hiroki Tsukamoto, Yingqiong Yong et al. · RSC Advances · 2016 · 65 citations · Full text

Materials Engineering, Materials Science, Chemical Engineering +13

The mechanism of alkylamine-stabilized copper fine particles towards improving the electrical conductivity of copper films at low sintering temperature

Yingqiong Yong, Tetsu Yonezawa, Masaki Matsubara et al. · Journal of Materials Chemistry C · 2015 · 49 citations · Full text

Materials Engineering, Materials Science, Electrical Engineering +14

Effect of decomposition and organic residues on resistivity of copper films fabricated via low-temperature sintering of complex particle mixed dispersions

Yingqiong Yong, Mai Thanh Nguyen, Hiroki Tsukamoto et al. · Scientific Reports · 2017 · 34 citations · Full text

Stabilization of the thermal decomposition process of self-reducible copper ion ink for direct printed conductive patterns

Kuan-Ming Huang, Hiroki Tsukamoto, Yingqiong Yong et al. · RSC Advances · 2017 · 33 citations · Full text

Engineering, Mechanical Engineering, Printed Patterns +16

Use of decomposable polymer-coated submicron Cu particles with effective additive for production of highly conductive Cu films at low sintering temperature

Yingqiong Yong, Mai Thanh Nguyen, Tetsu Yonezawa et al. · Journal of Materials Chemistry C · 2016 · 29 citations · Full text

Engineering, Conductive Cu Films, Chemical Deposition +17