Concepedia

Kenji Fukuzono

KF

Statistics

Publications

3

Citations

45

H-Index

3

Active since

2006

Affiliations

Fujitsu (Japan)(Current)

Kenji Fukuzono is an author at Fujitsu (Japan) specializing in computer engineering, materials engineering, and flexible electronics.

Top concepts

Publications per year

2006–2012

3

Publications

3

High-performance Flip-Chip BGA Technology Based on Thin-core and Coreless Package Substrate

Masateru Koide, Kenji Fukuzono, Hideaki� Yoshimura et al. · 2006 · 18 citations

, , +16

Low warpage coreless substrate for large-size LSI packages

Mamoru Kurashina, Daisuke Mizutani, Masateru Koide et al. · 2012 · 17 citations

, , +15

Low Warpage Coreless Substrate for IC Packages

Mamoru Kurashina, Daisuke Mizutani, Masateru Koide et al. · Transactions of The Japan Institute of Electronics Packaging · 2012 · 10 citations · Full text

, , +13

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