Brandon Noia

Pre-bond probing of TSVs in 3D stacked ICs

Brandon Noia, Krishnendu Chakrabarty · 2011 · 110 citations

Through-silicon Via, 3D Ic Architecture, Electrical Engineering +14

Test-Architecture Optimization and Test Scheduling for TSV-Based 3-D Stacked ICs

Brandon Noia, Krishnendu Chakrabarty, S.K. Goel et al. · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · 2011 · 63 citations

3D Ic Architecture, Test Scheduling, Vlsi Design +15

Optimization methods for post-bond die-internal/external testing in 3D stacked ICs

Brandon Noia, Krishnendu Chakrabarty, Erik Jan Marinissen · 2010 · 61 citations

Engineering, Mem Testing, Computer Architecture +19

Test-architecture optimization for TSV-based 3D stacked ICs

Brandon Noia, Sandeep Goel, Krishnendu Chakrabarty et al. · 2010 · 60 citations

3D Ic Architecture, Physical Design (Electronics), Engineering +13

Test-wrapper optimization for embedded cores in TSV-based three-dimensional SOCs

Brandon Noia, Krishnendu Chakrabarty, Yuan Xie · 2009 · 47 citations

Engineering, Vlsi Design, Computer Architecture +18