D.D. Chang

An overview and evaluation of anisotropically conductive adhesive films for fine pitch electronic assembly

D.D. Chang, P.A. Crawford, J.A. Fulton et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1993 · 70 citations

Engineering, Mechanical Engineering, Acaf Materials +19

Direct chip interconnect with adhesive-connector films

N.R. Basavanhally, D.D. Chang, B.H. Cranston et al. · 2003 · 29 citations

Engineering, Anisotropy Inherent, Interconnect (Integrated Circuits) +16

Analysis of Electric Stress Distribution in Cavities embedded within Dielectric Structures

D.D. Chang, T. S. Sudarshan, J. E. Thompson · IEEE Transactions on Electrical Insulation · 1986 · 24 citations

Materials Science, Materials Engineering, Electrical Engineering +14

Accelerated life test of Z-axis conductive adhesives

D.D. Chang, J.A. Fulton, H. C. Ling et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1993 · 11 citations

Engineering, Mechanical Engineering, Accelerated Life Test +19

An overview and evaluation of anisotropically conductive adhesive films for fine pitch electronic assembly

D.D. Chang, P.A. Crawford, J.A. Fulton et al. · 2002 · 10 citations