E. Egan

PBGA warpage and stress prediction for efficient creation of the thermomechanical design space for package-level reliability

E. Egan, Christopher V. Kelly, L. Herard · 2003 · 24 citations

Engineering, Materials Engineering, Materials Science +17

Thermal Management Strategies for Embedded Electronic Components of Wearable Computers

E. Egan, Cristina H. Amon · Journal of Electronic Packaging · 1999 · 16 citations

Engineering, Materials Engineering, Materials Science +17

Thermal management and concurrent system design of a wearable multicomputer

Cristina H. Amon, E. Egan, Asim Smailagic et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1997 · 15 citations · Full text

Engineering, Computer Engineering, Mechanical Engineering +15

Cooling strategies for embedded electronic components of wearable computers fabricated by shape deposition manufacturing

E. Egan, Cristina H. Amon · 2002 · 13 citations

Engineering, Materials Engineering, Materials Science +17

Response surface methodology for matrix PBGA warpage prediction

E. Egan, G. Kelly, Tom Odonovan et al. · 2002 · 11 citations

Engineering, Manufacturing Engineering, Materials Science +14