Concepedia

Zhiyuan Lai

ZL

6

Publications

206

Citations

6

H-Index

2019

Active since

Affiliations

Huaqiao University(Current)

Institute of Mechanics

San’an Optoelectronics (China)

Chinese Academy of Sciences

Zhiyuan Lai is an author at Huaqiao University specializing in mechanical engineering, engineering, and mechanics.

Top concepts

Mechanical EngineeringEngineeringMechanicsMachiningKinematicsUltrasoundKinesiologySoft MatterMechatronicsNanomechanics

Publications per year

2019–2023

6

Publications

6

Processing and machining mechanism of ultrasonic vibration-assisted grinding on sapphire

Yue Chen, Zhongwei Hu, Yiqing Yu et al. · Materials Science in Semiconductor Processing · 2022 · 68 citations · Full text

Engineering, Material Machining, Tool Wear +6

Coupling of double grains enforces the grinding process in vibration-assisted scratch: Insights from molecular dynamics

Zhongwei Hu, Yue Chen, Zhiyuan Lai et al. · Journal of Materials Processing Technology · 2022 · 53 citations · Full text

Materials Science, Vibration-assisted Scratch, Nanotribology +13

Dynamic model and machining mechanism of wire sawing

Zhiyuan Lai, Hui Huang, Zhongwei Hu et al. · Journal of Materials Processing Technology · 2022 · 30 citations

Industrial Design, Engineering, Industrial Engineering +7

Experimental study on the formation mechanism of saw marks in wire sawing

Zhiyuan Lai, Xinjiang Liao, Hao Yang et al. · International Journal of Mechanical Sciences · 2023 · 24 citations

Wire Sawing, Material Machining, Tool Wear +4

Study on the Wear Characteristics of a Lapping Wheel in Double-Sided Lapping Based on the Trajectory Distribution

Zhiyuan Lai, Zhongwei Hu, Congfu Fang et al. · IEEE Transactions on Semiconductor Manufacturing · 2019 · 17 citations

Double-sided Lapping, Engineering, Wear Testing +12

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