Concepedia

Peilun Yao

PY

3

Publications

50

Citations

3

H-Index

2019

Active since

Affiliations

University of Hong Kong(Current)

Hong Kong University of Science and Technology

Peilun Yao is an author at University of Hong Kong specializing in engineering, aeroelasticity, and structural mechanics.

ORCID

Top concepts

Publications per year

2019–2022

3

Publications

3

Microfluidic electroless deposition for uniform stacking chip interconnection: Simulation framework and experimental validation

Yonglin Zhang, Peilun Yao, Yuzi Han et al. · Chemical Engineering Journal · 2022 · 20 citations

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Analytical determination of the critical impact location for wing leading edge under birdstrike

Zeliang Yu, Pu Xue, Peilun Yao et al. · Latin American Journal of Solids and Structures · 2019 · 15 citations · Full text

, , +15

Physics-based Nested-ANN Approach for Fan-Out Wafer-Level Package Reliability Prediction

Peilun Yao, Jun Yang, Yonglin Zhang et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 15 citations

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