N. Arnal

A 2.45 GHz Phased Array Antenna Unit Cell Fabricated Using 3-D Multi-Layer Direct Digital Manufacturing

Thomas P. Ketterl, Yaniel Vega, N. Arnal et al. · IEEE Transactions on Microwave Theory and Techniques · 2015 · 107 citations

Engineering, Electrical Engineering, Materials Science +17

Fabrication of 3D packaging TSV using DRIE

M. Puech, J. M. Thevenoud, J. M. Gruffat et al. · 2008 · 67 citations · Full text

Engineering, Electrical Engineering, Materials Science +17

Advanced plasma processing combined with trench isolation technology for fabrication and fast prototyping of high aspect ratio MEMS in standard silicon wafers

E Sarajli, Meint J. de Boer, Henri Jansen et al. · Journal of Micromechanics and Microengineering · 2004 · 46 citations · Full text

Engineering, Electrical Engineering, Microelectromechanical Systems +15

3D multi-layer additive manufacturing of a 2.45 GHz RF front end

N. Arnal, Thomas P. Ketterl, Yaniel Vega et al. · 2015 · 36 citations

Engineering, Electrical Engineering, Manufacturing Engineering +16

Bulk micromachining technology for fabrication of two-level MEMS in standard silicon substrate

Edin Sarajlic, Meint J. de Boer, Henri Jansen et al. · 2005 · 11 citations · Full text

Engineering, Electrical Engineering, Microelectromechanical Systems +12