Zhongyang Deng

Sintering Mechanism of a Supersaturated Ag–Cu Nanoalloy Film for Power Electronic Packaging

Qiang Jia, Guisheng Zou, Wengan Wang et al. · ACS Applied Materials & Interfaces · 2020 · 60 citations

Sintering mechanism of Ag-Pd nanoalloy film for power electronic packaging

Qiang Jia, Guisheng Zou, Hongqiang Zhang et al. · Applied Surface Science · 2021 · 45 citations

Materials Engineering, Materials Science, Electrical Engineering +7

Cooperative Bilayer of Lattice-Disordered Nanoparticles as Room-Temperature Sinterable Nanoarchitecture for Device Integrations

Bin Feng, Daozhi Shen, Wengan Wang et al. · ACS Applied Materials & Interfaces · 2019 · 42 citations

Cooperative Bilayer, Engineering, Chemistry +20

Mechanical properties and microstructure of low temperature sintered joints using organic-free silver nanostructured film for die attachment of SiC power electronics

Wengan Wang, Guisheng Zou, Qiang Jia et al. · Materials Science and Engineering A · 2020 · 41 citations

Materials Science, Engineering, Die Attachment +6

Thermal stress reduction strategy for high-temperature power electronics with Ag sintering

Hui Ren, Guisheng Zou, Qiang Jia et al. · Microelectronics Reliability · 2021 · 32 citations

Materials Science, High-temperature Power Electronics, Electrical Engineering +7