H. A. Lord

Thermal and stress analysis of semiconductor wafers in a rapid thermal processing oven

H. A. Lord · IEEE Transactions on Semiconductor Manufacturing · 1988 · 192 citations

Engineering, Thermal Properties, Integrated Circuits +19

Mold‐filling studies for the injection molding of thermoplastic materials. Part II: The transient flow of plastic materials in the cavities of injection‐molding dies

H. A. Lord, G. Williams · Polymer Engineering and Science · 1975 · 122 citations

Materials Science, Injection Molding, Telephone Housing Molds +14

Mold‐filling studies for the injection molding of thermoplastic materials. Part I: The flow of plastic materials in hot‐ and cold‐walled circular channels

G. Williams, H. A. Lord · Polymer Engineering and Science · 1975 · 104 citations

Engineering, Thermoplastic Materials, Mechanical Engineering +16

Recycling plastics by two‐shot molding

R. C. Donovan, K. S. Rabe, W. K. Mammel et al. · Polymer Engineering and Science · 1975 · 34 citations

Engineering, Mechanical Engineering, Molding (Process) +16

Flow of polymers with pressure‐dependent viscosity in injection molding dies

H. A. Lord · Polymer Engineering and Science · 1979 · 31 citations

Engineering, Fluid Mechanics, Mechanical Engineering +18