Shengchang Ding

Publications

144

Citations

H-Index

2022

Active since

Affiliations

Shenzhen Institutes of Advanced Technology(Current)

Chinese Academy of Sciences

Nanchang University

Shengchang Ding is an author at Shenzhen Institutes of Advanced Technology specializing in mechanical engineering, materials science, and engineering.

ORCID

Top concepts

EngineeringMaterial ScienceMechanical EngineeringSoft MatterMechanicsHeat TransferSoft RoboticsApplied PhysicsPolymer ScienceHybrid Materials

Publications per year

2022–2023

Publications

Soft Composite Gels with High Toughness and Low Thermal Resistance through Lengthening Polymer Strands and Controlling Filler

Linfeng Cai, Jianfeng Fan, Shengchang Ding et al. · Advanced Functional Materials · 2022 · 51 citations

Controlling Filler, Engineering, Mechanical Engineering +21

High thermal conductivity and remarkable damping composite gels as thermal interface materials for heat dissipation of chip

Shengchang Ding, Jianfeng Fan, Dongyi He et al. · Chip · 2022 · 44 citations · Full text

Gecko-inspired adhesive structures enable efficiently thermal conductance and vibration dissipation in a highly mismatched system

Jianfeng Fan, Shengchang Ding, Xiangliang Zeng et al. · Chemical Engineering Journal · 2022 · 37 citations

Materials Science, Thermal Conductance, Engineering +12

Toward soft, stretchable and resilient high filled composite gels for potential application as thermal interface materials

Jianfeng Fan, Chunyu Wong, Weijian Wu et al. · Composites Science and Technology · 2023 · 12 citations

Materials Science, Biopolymer Gel, Engineering +8

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