Concepedia

Linfeng Cai

LC

3

Publications

107

Citations

3

H-Index

2022

Active since

Affiliations

Chinese Academy of Sciences(Current)

Shenzhen Institutes of Advanced Technology

Linfeng Cai is an author at Chinese Academy of Sciences specializing in mechanical engineering, soft matter, and materials science.

ORCID

Top concepts

Publications per year

2022–2023

3

Publications

3

Soft Composite Gels with High Toughness and Low Thermal Resistance through Lengthening Polymer Strands and Controlling Filler

Linfeng Cai, Jianfeng Fan, Shengchang Ding et al. · Advanced Functional Materials · 2022 · 51 citations

, , +21

High thermal conductivity and remarkable damping composite gels as thermal interface materials for heat dissipation of chip

Shengchang Ding, Jianfeng Fan, Dongyi He et al. · Chip · 2022 · 44 citations · Full text

Toward soft, stretchable and resilient high filled composite gels for potential application as thermal interface materials

Jianfeng Fan, Chunyu Wong, Weijian Wu et al. · Composites Science and Technology · 2023 · 12 citations

, , +8

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