Muhammad Salman Al Farisi

Wafer-level hermetic thermo-compression bonding using electroplated gold sealing frame planarized by fly-cutting

Muhammad Salman Al Farisi, Hideki Hirano, Jörg Frömel et al. · Journal of Micromechanics and Microengineering · 2016 · 49 citations

Engineering, Materials Engineering, Materials Science +17

Advancements in MEMS technology for medical applications: microneedles and miniaturized sensors

Mitsuhiro Shikida, Yoshihiro Hasegawa, Muhammad Salman Al Farisi et al. · Japanese Journal of Applied Physics · 2021 · 31 citations

Engineering, Bioengineering, Biomedical Engineering +16

Low-temperature hermetic thermo-compression bonding using electroplated copper sealing frame planarized by fly-cutting for wafer-level MEMS packaging

Muhammad Salman Al Farisi, Hideki Hirano, Shuji Tanaka · Sensors and Actuators A Physical · 2018 · 28 citations

Engineering, Materials Engineering, Materials Science +14

Aluminum Patterned Electroplating from AlCl3–[EMIm]Cl Ionic Liquid towards Microsystems Application

Muhammad Salman Al Farisi, Silvia Hertel, Maik Wiemer et al. · Micromachines · 2018 · 26 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +16

Facile In-Tube-Center Packaging of Flexible Airflow Rate Microsensor for Simultaneous Respiration and Heartbeat Measurement

Muhammad Salman Al Farisi, Yang Wang, Yoshihiro Hasegawa et al. · IEEE Sensors Journal · 2023 · 25 citations

Engineering, Bioengineering, Biomedical Engineering +17