Concepedia

Tobias Pflock

TP

Statistics

Publications

2

Citations

54

H-Index

2

Active since

2018

Affiliations

University of Wisconsin–Madison(Current)

Tobias Pflock is an author at University of Wisconsin–Madison specializing in polymer characterization, polymer engineering, and materials engineering.

Publications per year

2018–2019

2

Publications

2

Dielectric and rheological study of the molecular dynamics during the cure of an epoxy resin

Alexander Chaloupka, Tobias Pflock, Robert Horny et al. · Journal of Polymer Science Part B Polymer Physics · 2018 · 30 citations

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Dielectric analysis monitoring of thermoset curing with ionic liquids: From modeling to the prediction in the resin transfer molding process

Martin Demleitner, Sandra A. Sanchez‐Vazquez, Daniel Raps et al. · Polymer Composites · 2019 · 24 citations

, , +17

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