Alexander Chaloupka

Design, fabrication and embedding of microscale interdigital sensors for real-time cure monitoring during composite manufacturing

Maryam Kahali Moghaddam, Arne Breede, Alexander Chaloupka et al. · Sensors and Actuators A Physical · 2016 · 62 citations

Engineering, Materials Engineering, Materials Science +16

Dielectric and rheological study of the molecular dynamics during the cure of an epoxy resin

Alexander Chaloupka, Tobias Pflock, Robert Horny et al. · Journal of Polymer Science Part B Polymer Physics · 2018 · 30 citations

Natural Sciences, Materials Engineering, Materials Science +17

Dielectric analysis monitoring of thermoset curing with ionic liquids: From modeling to the prediction in the resin transfer molding process

Martin Demleitner, Sandra A. Sanchez‐Vazquez, Daniel Raps et al. · Polymer Composites · 2019 · 24 citations

Natural Sciences, Materials Engineering, Materials Science +17

Quasi‐isothermal <scp>DSC</scp> testing of epoxy adhesives using initial fast heating rates

John Puentes, Nora Catalina Restrepo‐Zapata, Alexander Chaloupka et al. · Journal of Applied Polymer Science · 2017 · 11 citations · Full text

Engineering, Materials Engineering, Materials Science +17

<scp>TTT</scp>‐diagram for epoxy film adhesives using quasi‐isothermal scans with initial fast ramps

John Puentes, Alexander Chaloupka, Natalie Rudolph et al. · Journal of Applied Polymer Science · 2017 · 11 citations

Natural Sciences, Materials Engineering, Materials Science +17