V. Desai

Mechanism of Copper Removal during CMP in Acidic H[sub 2]O[sub 2] Slurry

T. Du, Dnyanesh Tamboli, V. Desai et al. · Journal of The Electrochemical Society · 2004 · 101 citations

Engineering, Alumina Particles, Chemistry +19

Evaluation of thickness, porosity and pore shape of plasma sprayed TBC by electrochemical impedance spectroscopy

J. Zhang, V. Desai · Surface and Coatings Technology · 2004 · 89 citations

Materials Science, Thermal Spray Coating, Electrical Engineering +7

Surface chemistry of Nextel-720, alumina and Nextel-720/alumina ceramic matrix composite (CMC) using XPS–A tool for nano-spectroscopy

Surasak Wannaparhun, Sudipta Seal, V. Desai · Applied Surface Science · 2002 · 50 citations

Materials Science, Engineering, Surface Chemistry +8

Studies on passivation behavior of tungsten in application to chemical mechanical polishing

Dnyanesh Tamboli, Sudipta Seal, V. Desai et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 1999 · 50 citations

Engineering, Mechanical Engineering, Chemical Engineering +21

Polishing mechanism of tantalum films by SiO2 particles

A. G. Vijaya Kumar, T. Du, Kalpathy B. Sundaram et al. · Microelectronic Engineering · 2003 · 43 citations

Materials Engineering, Materials Science, Engineering +4