Jae Hyeon Shin

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Active since

2005

Affiliations

Amkor Technology (United States)(Current)

Jae Hyeon Shin is an author at Amkor Technology (United States) specializing in materials characterization, package reliability, and packaging engineering.

Publications per year

2005–2007

Publications

A Methodology for Drop Performance Modeling and Application for Design Optimization of Chip-Scale Packages

Seung Mo Kim, Wei Lin, Jin Young Khim et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2007 · 66 citations

Engineering, Materials Science, Materials Characterization +16

A methodology for drop performance prediction and application for design optimization of chip scale packages

A. Syed, Seung Mo Kim, Wei Lin et al. · 2005 · 30 citations

Engineering, Materials Engineering, Materials Science +17

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