Statistics
Publications
2
Citations
82
H-Index
2
Active since
2001
Affiliations
Rick Lathrop is an author at Amkor Technology (United States) specializing in materials science, electronic packaging, and microelectronics.
Publications per year
2001–2008
2
2
High temperature lead-free solder for microelectronics
Frank W. Gayle, G.A. Becka, Ahmer Syed et al. · JOM · 2001 · 72 citations
Novel Approaches to Current BGA Packaging Challenges
ChangGyun Ryu, Jackson Hsu, Lito Mendoza et al. · 2008 · 10 citations
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