Xingzhou Cai

Statistics

Publications

Citations

153

H-Index

Active since

2022

Affiliations

University of Electronic Science and Technology of China(Current)

National Engineering Research Center of Electromagnetic Radiation Control Materials

Southwest China Institute of Electronic Technology

Xingzhou Cai is an author at University of Electronic Science and Technology of China specializing in semiconductor devices, materials science, and integrated circuit fabrication.

Publications per year

2022–2024

Publications

Analysis and Optimization of Sidewall Roughness on Microwave Performance of Through-Glass Vias in 3-D Integrated Circuits

Zhen Fang, Jihua Zhang, Jinxu Liu et al. · IEEE Transactions on Microwave Theory and Techniques · 2023 · 31 citations

Engineering, Electrical Engineering, Materials Science +17

General Analytical Method for Investigating Parasitic Characteristics of Through Glass Vias (TGVs) in 3-D Integration

Wenlei Li, Jihua Zhang, Lingyue Wang et al. · IEEE Transactions on Electron Devices · 2023 · 22 citations

Engineering, Electrical Engineering, Materials Science +16

A Low-Loss Slow Wave SIW Bandpass Filter With Blind via-Holes Using TGV Technology

Lingyue Wang, Hongwei Chen, Wenlei Li et al. · IEEE Microwave and Wireless Technology Letters · 2024 · 15 citations

Engineering, Electrical Engineering, Microwave Engineering +13

Ka-band broadband filtering packaging antenna based on through-glass vias (TGVs)

Zhen Fang, Jihua Zhang, Libin Gao et al. · Frontiers of Information Technology & Electronic Engineering · 2023 · 14 citations

Engineering, Electrical Engineering, Materials Science +17

Absorptive Filtering Packaging Antenna Design Based on Through-Glass Vias

Zhen Fang, Jihua Zhang, Libin Gao et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2023 · 14 citations

Engineering, Electrical Engineering, Antennas +16

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