Ganesh Dongre

Multi-objective optimization for silicon wafer slicing using wire-EDM process

Ganesh Dongre, Sagar Zaware, Uday A. Dabade et al. · Materials Science in Semiconductor Processing · 2015 · 45 citations

Physical Design (Electronics), Wafer Scale Processing, Engineering +3

Surface integrity investigation including grinding burns using barkhausen noise (BNA)

Azhar Thanedar, Ganesh Dongre, Rajkumar Singh et al. · Journal of Manufacturing Processes · 2017 · 36 citations

Materials Science, Barkhausen Noise, Engineering +9

Analytical Modelling of Temperature in Cylindrical Grinding to Predict Grinding Burns

Azhar Thanedar, Ganesh Dongre, Suhas S. Joshi · International Journal of Precision Engineering and Manufacturing · 2019 · 28 citations

Predict Grinding Burns, Engineering, Material Machining +6

Achieving controlled topography and wettability through laser surface texturing of Ti6Al4V for bioengineering applications

Neelesh Sirdeshmukh, Ganesh Dongre · Results in Engineering · 2023 · 23 citations · Full text

Preparation of super-hydrophobic textures by using nanosecond pulsed laser

Ganesh Dongre, Avadhoot Rajurkar, Ravi Raut et al. · Materials Today Proceedings · 2021 · 22 citations

Materials Science, Engineering, Surface Science +4