Statistics
Publications
2
Citations
20
H-Index
2
Active since
2019
Affiliations
Georg Friedrich is an author at Fraunhofer Institute for Reliability and Microintegration specializing in wafer bonding, electrical engineering, and microelectromechanical systems.
Publications per year
2019–2020
2
2
Vertical Laser Assisted Bonding for Advanced "3.5D" Chip Packaging
Andrej Kolbasow, Timo Kubsch, Matthias Fettke et al. · 2019 · 10 citations
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