Mengran Ge

Material removal mechanism and crack propagation in single scratch and double scratch tests of single-crystal silicon carbide by abrasives on wire saw

Peizhi Wang, Peiqi Ge, Mengran Ge et al. · Ceramics International · 2018 · 84 citations

Engineering, Materials Engineering, Materials Science +17

Investigation on critical crack-free cutting depth for single crystal silicon slicing with fixed abrasive wire saw based on the scratching machining experiments

Mengran Ge, Hongtao Zhu, Chuanzhen Huang et al. · Materials Science in Semiconductor Processing · 2017 · 77 citations

Engineering, Materials Engineering, Materials Science +12

Unidirectional Thermal Diffusion in Bimetallic Cu@Au Nanoparticles

Shoujie Liu, Zhihu Sun, Qinghua Liu et al. · ACS Nano · 2014 · 53 citations

Natural Sciences, Materials Engineering, Materials Science +16

Experimental and numerical study on heat transfer enhancement by Flow-induced vibration in pulsating flow

Derong Duan, Yujun Cheng, Mengran Ge et al. · Applied Thermal Engineering · 2022 · 52 citations

Engineering, Mechanical Engineering, Physics +16

A scratching force model of diamond abrasive particles in wire sawing of single crystal SiC

Peizhi Wang, Peiqi Ge, Zongqiang Li et al. · Materials Science in Semiconductor Processing · 2017 · 38 citations

Engineering, Materials Engineering, Materials Science +15