Concepedia

Siyang Dai

SD

Statistics

Publications

3

Citations

77

H-Index

3

Active since

2020

Affiliations

Dalian University of Technology(Current)

Siyang Dai is an author at Dalian University of Technology specializing in engineering, electronic packaging, and thermal engineering.

Top concepts

EngineeringHeat TransferMicroelectronicsPower ElectronicsThermal EngineeringElectronic PackagingElectrical EngineeringMechanical EngineeringMechanics Of MaterialsRefrigeration

Publications per year

2020–2022

3

Publications

3

Effect of grinding damage on cutting force and ductile machining during single grain scratching of monocrystalline silicon

Ming Li, Xiaoguang Guo, Siyang Dai et al. · Materials Science in Semiconductor Processing · 2022 · 35 citations

Materials Science, Ductile Machining, Engineering +11

Thermal Management System for Press-Pack IGBT Based on Liquid Metal Coolant

Yerasimos Yerasimou, Volker Pickert, Siyang Dai et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2020 · 25 citations · Full text

Engineering, Liquid Metal Cooling, Thermal Energy Storage +19

Thermal and Mechanical Analyses of Clamping Area on the Performance of Press-Pack IGBT in Series-Connection Stack Application

Siyang Dai, Zhiqiang Wang, Haimeng Wu et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2021 · 17 citations

Engineering, Mechanical Engineering, Power Electronics +18

1–3 of 3