Concepedia

A. Feingold

AF

9

Publications

237

Citations

9

H-Index

1966

Active since

Affiliations

AT&T (United States)(Current)

Cornell University

A. Feingold is an author at AT&T (United States) specializing in engineering, surface science, and materials science.

Top concepts

EngineeringThin FilmsSurface ScienceMaterial ScienceApplied PhysicsChemistryChemical EngineeringHigh Temperature MaterialsOptoelectronicsChemical Kinetics

Publications per year

1966–2002

9

Publications

9

Mass transport analysis for ostwald ripening and related phenomena

Che‐Yu Li, J. M. Blakely, A. Feingold · Acta Metallurgica · 1966 · 70 citations

Engineering, Diffusion Resistance, Mass Transport Analysis +5

Properties of titanium nitride thin films deposited by rapid-thermal-low-pressure-metalorganic-chemical-vapor-deposition technique using tetrakis (dimethylamido) titanium precursor

A. Katz, A. Feingold, S. J. Pearton et al. · Journal of Applied Physics · 1991 · 48 citations

Materials Science, Rapid-thermal-low-pressure-metalorganic-chemical-vapor-deposition Technique, Titanium Precursor +14

The influence of ammonia on rapid-thermal low-pressure metalorganic chemical vapor deposited TiN<i>x</i> films from tetrakis (dimethylamido) titanium precursor onto InP

A. Katz, A. Feingold, S. Nakahara et al. · Journal of Applied Physics · 1992 · 37 citations

Materials Science, Process Kinetics, Chemical Engineering +13

Experimental verification of mass transport analysis for ostwald ripening and related phenomena

A. Feingold, Che‐Yu Li · Acta Metallurgica · 1968 · 19 citations

Chemical Engineering, Experimental Verification, Engineering +8

Rapid thermal low-pressure chemical vapor deposition of SiO<i>x</i> films onto InP

A. Katz, A. Feingold, S. J. Pearton et al. · Applied Physics Letters · 1991 · 17 citations

Materials Science, Optical Materials, Siox Films +11

Rows per page

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