Hengmao Liang

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Active since

2018

Affiliations

Shanghai Institute of Microsystem and Information Technology(Current)

University of Chinese Academy of Sciences

Hengmao Liang is an author at Shanghai Institute of Microsystem and Information Technology specializing in engineering, electrical engineering, and microelectronics.

ORCID

Top concepts

EngineeringElectrical Engineering3D IntegrationApplied PhysicsMicroelectronicsMicrofabricationAdvanced PackagingIntegrated CircuitsElectronic PackagingMagnetism

Publications per year

2018–2022

Publications

An out-of-plane electromagnetic induction based resonant MEMS magnetometer

Song Liu, Hengmao Liang, Bin Xiong · Sensors and Actuators A Physical · 2018 · 29 citations

Magnetism, Electrical Engineering, Engineering +5

Two-Mask Wafer-Level Vacuum Packaging With Bulk-Si 3D Interconnects for MEMS Devices and Its Package Performances

Hengmao Liang, Xiao He, Bin Xiong · IEEE Sensors Journal · 2022 · 20 citations

Mems Devices, Engineering, Integrated Circuits +18

3D wafer level packaging technology based on the co-planar Au–Si bonding structure

Hengmao Liang, Song Liu, Bin Xiong · Journal of Micromechanics and Microengineering · 2019 · 16 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +19

In-Plane-Sense Magnetometer Based on Torsional MEMS With Vertically-Interlaced Combs via Self-Alignment Technique

Hengmao Liang, Song Liu, Bin Xiong · IEEE Electron Device Letters · 2020 · 10 citations

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