Concepedia
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Publications
1
Citations
15
H-Index
Active since
2022
Affiliations
SK Group (South Korea)(Current)
Dail Rim is an author at SK Group (South Korea).
Publications per year
2022–2022
The Wafer Bonding yield improvement through control of SiCN Film composition and Cu Pad Shape
Dail Rim, Byeong-Ho Lee, Jin-Won Park et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 2022 · 15 citations
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