Jau-Sheng Wang

Mean-time-to-failure evaluations of encapsulation materials for LED package in accelerated thermal tests

Jau-Sheng Wang, Chun‐Chin Tsai, Jyun-Sian Liou et al. · Microelectronics Reliability · 2011 · 38 citations

Engineering, Materials Engineering, Materials Science +17

Preform fabrication and fiber drawing of 300 nm broadband Cr-doped fibers

Yi-Chung Huang, Jau-Sheng Wang, Yu-Kuan Lu et al. · Optics Express · 2007 · 32 citations · Full text

Natural Sciences, Materials Engineering, Materials Science +16

Thermal-Stability Comparison of Glass- and Silicone-Based High-Power Phosphor-Converted White-Light-Emitting Diodes Under Thermal Aging

Chun‐Chin Tsai, Jin-Kai Chang, Shun-Yuan Huang et al. · IEEE Transactions on Device and Materials Reliability · 2012 · 31 citations

Engineering, Electrical Engineering, Materials Engineering +17

Broadband Chromium-Doped Fiber Amplifiers for Next-Generation Optical Communication Systems

Szu-Ming Yeh, Sheng‐Lung Huang, Yi‐Jen Chiu et al. · Journal of Lightwave Technology · 2012 · 31 citations

Engineering, Communication, Electrical Engineering +17

Development of Broadband Single-Mode Cr-Doped Silica Fibers

Yi-Chung Huang, Jau-Sheng Wang, Yen-Sheng Lin et al. · IEEE Photonics Technology Letters · 2010 · 24 citations

Engineering, Materials Engineering, Materials Science +17